Silicon Wafer Properties For Use With FTIR

Issue

What are three key properties for the silicon wafer that will give the optimum performance in FTIR analysis?

Environment

FT-IR

Resolution

• Backside finish should be selected to be low scattering (bright-etch) for best S/N and low variability
• Resistivity needs to be above 5 ꭥ-cm to maintain optical transparency and eliminate variability from this source
• Interstitial oxygen should be controlled to minimize spectral variation introduced from the wafer